Title:
地盤穿孔装置
Document Type and Number:
Japanese Patent JP4500203
Kind Code:
B2
Inventors:
Masato Nozaki
Application Number:
JP2005131396A
Publication Date:
July 14, 2010
Filing Date:
April 28, 2005
Export Citation:
Assignee:
WBM Co., Ltd.
Japan Basic Technology Co., Ltd.
Japan Basic Technology Co., Ltd.
International Classes:
E21B6/00
Domestic Patent References:
| JP2002097883A | ||||
| JP2002322888A | ||||
| JP2002115482A | ||||
| JP51004803A |
Attorney, Agent or Firm:
Motonari Tomisaki
Sadao Enjoji
Sadao Enjoji