Title:
GROUND ESTIMATION METHOD AND GROUND ESTIMATION SYSTEM
Document Type and Number:
Japanese Patent JP2023032495
Kind Code:
A
Abstract:
To efficiently acquire ground information on a drilled point based on drilling data at the time of drilling with high accuracy.SOLUTION: A ground estimation method for estimating ground information on a drilled point based on rotational torque at the time of drilling estimates ground strength in the ground information using a previously acquired N value estimation formula. The N value estimation formula is calculated by: a drilling information acquisition step of drilling a reference point set in the vicinity of an investigation point where an actually measured N value is known for each actually measured depth, and acquiring the rotational torque; a soil determination step of giving an arbitrary soil determination value to soil for each depth of the reference point, and acquiring a soil determination result of the reference point; an analysis preparation step of performing speed correction to make speed in a depth direction constant on the rotational torque of the reference point, then calculating a representative value corresponding to the actually measured depth as rotational torque for analysis, and calculating a representative value corresponding to the actually measured depth from the soil determination result of the reference point as a soil determination value for analysis; and an estimation formula acquisition step of performing regression analysis using the actually measured N value as a target variable and the rotational torque for analysis and the soil determination value for analysis as explanatory variables.SELECTED DRAWING: Figure 1
Inventors:
SASAKI TORU
MIURA KUNIHARU
INAGAWA YUSEN
SHIGENO KEIKO
MIURA KUNIHARU
INAGAWA YUSEN
SHIGENO KEIKO
Application Number:
JP2021138659A
Publication Date:
March 09, 2023
Filing Date:
August 27, 2021
Export Citation:
Assignee:
OHBAYASHI CORP
International Classes:
E02D1/02
Attorney, Agent or Firm:
Patent Attorney Corporation Isshiki International Patent Office