Title:
GROUNDING DEVICE
Document Type and Number:
Japanese Patent JP3544373
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a grounding device capable of facilitating mounting of a grounding part on an electric circuit board.
SOLUTION: This grounding device has at least one of grounding parts 42 and 43 in contact with grounded parts 28 and 30 requiring grounding and a U-shaped spring shaped clip part 45 holdable at an edge part 44 of the electric circuit board 26. The grounding parts 42 and 43 have contact parts 42a and 43a to contact the grounded parts 28 and 30 on tip sides, and are connected to the clip part 45 on base end sides. The grounding pars 42 and 43 and the clip part 45 are integrally formed by bending a material having elasticity.
Inventors:
Shigenori Ohira
Sano adult
Setsuya Uchino
Sano adult
Setsuya Uchino
Application Number:
JP2002199968A
Publication Date:
July 21, 2004
Filing Date:
March 30, 1998
Export Citation:
Assignee:
Calsonic Kansei Co., Ltd.
International Classes:
H01R4/48; H05F3/02; (IPC1-7): H01R4/48
Domestic Patent References:
| JP9018181A | ||||
| JP6088064U | ||||
| JP1087598U | ||||
| JP8124607A | ||||
| JP64007767U |
Attorney, Agent or Firm:
Mikio Hatta
Atsushi Nogami
Yasuo Nara
Etsuko Saito
Katsuyuki Utani
Atsushi Nogami
Yasuo Nara
Etsuko Saito
Katsuyuki Utani