Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
GUIDE MECHANISM IN BUNDLING WIRE IN REINFORCING BAR-BUNDLING MACHINE
Document Type and Number:
Japanese Patent JP3050517
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To always bundle reinforcing bars in a stable manner by forming a longitudinal slit-shaped guide part for guiding a wire, which is sent out, in front of a twisting mechanism, which holds and twists a part of a wire to be wound around reinforcing bars so as to be bound thereto and making the width of the guide part expandable.
SOLUTION: If a forward end part of a contact plate 10 of a reinforcing bar bundling machine is pressed against an intersection of reinforcing bars 6, a wire 4 delivered by means of a wire feed mechanism 7 is guided by a guide part and wound around the intersection of reinforcing bars 6. And when a predetermined number of winds of wire are provided, the wire 4 is cut off by a cutting mechanism 8 and twisted and tightened by a twisting hook 9a of a twisting mechanism 9. When the hook 9a is turned, the wire is moved in the turning direction of the hook, however, the wire 4 is situated inside the guide part and hence it is prevented from being moved. And since upper and lower guide members 11a, 11b of the guide part are formed so as to be opened when the guide part is pushed by a twisting part 15, the bundling machine can be easily removed after bundling operation.


Inventors:
Keijiro Murayama
Ichiro Kusakari
Atsushi Miyazaki
Shuichi Ishii
Application Number:
JP34725195A
Publication Date:
June 12, 2000
Filing Date:
December 14, 1995
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
Max Co., Ltd.
International Classes:
E04G21/12; B65B13/16; B65B13/28; B65B27/10; (IPC1-7): B65B13/16; B65B13/28; B65B27/10
Domestic Patent References:
JP592103U
JP740411U
Attorney, Agent or Firm:
Mikio Segawa