Title:
HIGH-TEMPERATURE Pb-FREE SOLDER PASTE AND MANUFACTURING METHOD THEREOF
Document Type and Number:
Japanese Patent JP2017177122
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a high-temperature Pb-free solder paste using a Bi-based alloy which has sufficient bonding strength to electronic components, such as IC chips, Peltier elements, and power semiconductor devices, and substrates, causes less unmelted residue of solder alloy powder, and has excellent wettability; and a method of manufacturing the high-temperature Pb-free solder paste.SOLUTION: A solder paste composed of solder alloy powder, flux, and stearic acid or/and stearate contains not less than 5.0 mass% nor more than 20.0 mass% of flux, not less than 0.01 mass% nor more than 10.0 mass% of stearic acid or/and stearate, and a remainder with respect to a total of 100 mass% of the solder paste. Solder alloy powder of the remainder is composed of Bi-based solder alloy powder.SELECTED DRAWING: None
Inventors:
BONG SHUNKAI
Application Number:
JP2016064681A
Publication Date:
October 05, 2017
Filing Date:
March 28, 2016
Export Citation:
Assignee:
SUMITOMO METAL MINING CO
International Classes:
B23K35/363; B23K35/26; C22C12/00
Attorney, Agent or Firm:
Shinohara International Patent Office
Yasushi Shinohara
Masayuki Fujinaka
Kazuhiro Suzuki
Yasushi Shinohara
Masayuki Fujinaka
Kazuhiro Suzuki