ハロゲンフリー難燃性接着剤組成物

Japanese Patent JP5846290

B2

This halogen-free flame-retardant adhesive composition contains (A) solvent-soluble polyamide resin that is solid at 25°C, (B) phenoxy resin, (C) halogen atom-free epoxy resin, and (D) phosphorus-based flame retardant having a structure shown by general formula (1); the content of phenoxy resin (B) is 50-500 parts by mass per 100 parts by mass of polyamide resin (A); the content of epoxy resin (C) is 1-60 parts by mass per 100 total parts by mass of polyamide resin (A) and phenoxy resin (B); and the content of phosphorus-based flame retardant (D) is 5-100 parts by mass per 100 total parts by mass of polyamide resin (A) and phenoxy resin (B).

JPH10324849	MANUFACTURING OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
JP2003165894	RESIN COMPOSITION, METAL CLAD LAMINATED BOARD FOR FLEXIBLE PRINTED CIRCUIT BOARD, COVERLAY FILM AND FLEXIBLE PRINTED CIRCUIT BOARD
JPH10168204	ADHESIVE FILM FOR SEMICONDUCTOR, AND LEAD FRAME AND SEMICONDUCTOR DEVICE USING THE SAME

Shigeshi Yamada
Makoto Hirakawa
Takashi Nakatani

JP2014503760A

January 20, 2016

February 22, 2013

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Toagosei Co., Ltd.

C09J177/10; B32B15/088; B32B27/00; B32B27/34; C09J7/22; C09J7/35; C09J11/06; C09J163/00; C09J171/10; H05K1/03

JP2010037489A
JP2003221509A
JP2006316234A
JP2002284963A
JP2008184591A

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