Title:
THERMOSETTING COMPOSITION
Document Type and Number:
Japanese Patent JP3152038
Kind Code:
B2
Abstract:
PURPOSE: To obtain a thermosetting compsn. excellent in adhesion to a substrate, substrate-flattening effects, coating film toughness, heat resistances, weatherability, water resistance, etc., by incorporating an epoxy resin and a specific solvent into the compsn.
CONSTITUTION: This thermosetting compsn. contains an epoxy resin and at least one solvent selected from the group consisting of a hydroxycarboxylic ester, an alkoxycarboxylic ester, a propylene glycol monoalkyl ester, and a propylene glycol ether ester. Pref. examples of the resin are polyglycidyl acrylate and a bisphenol A epoxy resin; pref. solvents are ethyl lactate and 3-methoxymethyl propionate. The compsn. may further contain a curative (e.g. phthalic anhydride), an adhesion promote (e.g. vinyltrimethoxysilane), a surfactant, etc.
Inventors:
Tsutomu Shimokawa
Masayuki Endo
Nobuo Bessho
Masayuki Endo
Nobuo Bessho
Application Number:
JP29603993A
Publication Date:
April 03, 2001
Filing Date:
November 01, 1993
Export Citation:
Assignee:
JSR Corporation
International Classes:
C08G59/62; C08K5/04; C08L63/00; C09D163/00; G02B5/20; G02F1/13; (IPC1-7): C08L63/00; C08K5/04; C09D163/00
Domestic Patent References:
| JP60216307A | ||||
| JP3188153A | ||||
| JP453879A | ||||
| JP4300942A |