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Title:
HARD MATERIAL CUTTING BAND SAW AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JPH02274416
Kind Code:
A
Abstract:

PURPOSE: To firmly connect a band streak plate to a chip so that the chips can resist the heavier cutting by providing many holes in the peripheral edge of a notched part to which the chip is connected and pressing the chip so that it infiltrate into the respective holes.

CONSTITUTION: Respectively between slits 2, a notched part 3 is provided drilling in its peripheral edge part 5 many holes 6. A chip 4, consisting of a mixture with metal dust containing abrasive grains of diamond serving as a binding agent, is formed in rectangular parallelepiped shape previously larger in the thickness than the thickness of a band streak plate 1, and the chip 4 is formed protruding to the upper to a degree of about the half from the notched part 3 while placing an insertion fitting part so as to almost agree with the notched part 3. The chip 4 is fitted to the notched part 3, and by pressing while heating the chip 4 from both side surfaces in the thickness direction, the chip 4 decreases the thickness smaller than that in the beginning while covering the outer side peripheral edge part 5 of the notched part 3. Soon the chip 4 is guided to infiltrate into the respective holes 6, sintered and connected in a part where the chip 4 is adapted to the notched part 3.


Inventors:
MATSUDA TAKATSUGU
Application Number:
JP9588189A
Publication Date:
November 08, 1990
Filing Date:
April 14, 1989
Export Citation:
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Assignee:
SANWA DIAMOND KOGYO KK
International Classes:
B23D61/14; B23D65/00; B28D1/12; (IPC1-7): B23D61/14; B23D65/00
Domestic Patent References:
JPS6238088A1987-02-19
JPS62251010A1987-10-31
JPS49106687A1974-10-09
Attorney, Agent or Firm:
Zenkei Okada (3 outside)