Title:
ヘッドユニット及び液体吐出装置
Document Type and Number:
Japanese Patent JP7006099
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a head unit which can reduce a calorific value of a wiring board connected to a driving module having a number of high-density driving elements.SOLUTION: A head unit comprises: a driving module having a first substrate, 600 or more driving elements arranged side-by-side with density of 300 or more per inch, and a second substrate; and a flexible wiring board connecting the first substrate and the second substrate. The flexible wiring board includes: a first wiring layer; a second wiring layer facing the first wiring layer; a first output terminal electrically connected to each first end of the driving elements; a second output terminal electrically connected to each second end of the driving elements; first wiring electrically connected to the first output terminal; second wiring electrically connected to the second output terminal; and a through hole electrically connecting the first wiring layer and the second wiring layer. The first wiring is provided at the first wiring layer, and the second wiring is provided at the second wiring layer. The second wiring is thicker than the first wiring.SELECTED DRAWING: Figure 19
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Inventors:
Toru Kashimura
Application Number:
JP2017191774A
Publication Date:
January 24, 2022
Filing Date:
September 29, 2017
Export Citation:
Assignee:
Seiko Epson Corporation
International Classes:
H05K1/02; B41J2/14; H05K1/11; H05K1/14
Domestic Patent References:
| JP2011167956A | ||||
| JP2012011704A | ||||
| JP2011235521A | ||||
| JP2010214603A | ||||
| JP2008290387A | ||||
| JP2006181985A |
Foreign References:
| US8876256 |
Attorney, Agent or Firm:
Fuse Yukio
Michie Obuchi
Michie Obuchi