Title:
HEART DISSIPATING BOARD
Document Type and Number:
Japanese Patent JP3518881
Kind Code:
B2
Abstract:
PURPOSE: To obtain a heat dissipating board having a relatively low cost and large heat dissipating characteristics by connecting fins in which a material has a predetermined value or more of thermal conductivity to a platelike base material.
CONSTITUTION: Fins 2 of, for example, vapor phase synthetic crystalline diamond having a thermal conductivity of 5W/cm.K or more are embedded in a depth half the thickness of a platelike mounting board 1 or deeper in which its material is alumina, etc., and which has relatively low thermal conductivity and general-purpose properties. Thus, a semiconductor element has a structure in which heat generated from the element is dissipated through the diamond having high thermal conductivity, and a quantity of a material having a high cost and high thermal conductivity is reduced, and its heat dissipating efficiency can be increased. Accordingly, a high output, a high speed element which has been heretofore impossible to mount on a board using alumina, etc., can be mounted with a low cost.
Inventors:
Yamamoto, Yoshiyuki
Imai, Takahiro
Fujimori, Naoharu
Imai, Takahiro
Fujimori, Naoharu
Application Number:
JP14169193A
Publication Date:
April 12, 2004
Filing Date:
June 14, 1993
Export Citation:
Assignee:
SUMITOMO ELECTRIC IND LTD
International Classes:
H01L23/12; H01L23/36; H01L23/373; (IPC1-7): H01L23/373; H01L23/36
Attorney, Agent or Firm:
中野 稔 （外３名）
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