Title:
HEAT BONDING FILM AND METHOD OF FORMING THE SAME
Document Type and Number:
Japanese Patent JP2010162892
Kind Code:
A
Abstract:
To provide a heat bonding film capable of simplifying a formation process and reducing its formation cost.
The heat bonding film includes a hot-melt adhesive film and a protective layer disposed on the hot-melt adhesive film. The hot-melt adhesive film exhibits adhesive power after being heated. While the outer surface of the protective layer is heated, the heat bonding film is attached to an object to be adhered by the adhesive power generated by the hot-melt adhesive film.
COPYRIGHT: (C)2010,JPO&INPIT
Inventors:
CHIU JU-CHEN
Application Number:
JP2009293735A
Publication Date:
July 29, 2010
Filing Date:
December 25, 2009
Export Citation:
Assignee:
COMPAL ELECTRONICS INC
International Classes:
B32B27/08; C09J7/35; B32B27/00; C08J7/04
Domestic Patent References:
| JPH03193340A | 1991-08-23 | |||
| JP2006150949A | 2006-06-15 | |||
| JP2002355850A | 2002-12-10 | |||
| JPS6364744A | 1988-03-23 | |||
| JPH03176141A | 1991-07-31 |
Attorney, Agent or Firm:
Keisei Nishikawa
Atsuo Mori
Mizuhiji Katsuhisa
Yoshishige Takeo
Takeshi Sakaguchi
Hidetoshi Kitade
Kyohei Tokioka
Yutaka Kimura
Atsuo Mori
Mizuhiji Katsuhisa
Yoshishige Takeo
Takeshi Sakaguchi
Hidetoshi Kitade
Kyohei Tokioka
Yutaka Kimura
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