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Title:
Heat conduction device
Document Type and Number:
Japanese Patent JP6340641
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a heat conduction device which can achieve a reduction in weight of a graphene sheet without impairing heat conductivity in an in-plane direction.SOLUTION: A heat conduction device 1 comprises: a heating member 2 which generates heat by energy supplied thereto; a heat dissipation member 3 which dissipates the heat of the heating member 2 to the outside; and a graphene sheet 10 which is a heat-conducting member connecting between the heating member 2 and the heat dissipation member 3 so as to enable heat-conduction therebetween. The graphene sheet 10 comprises: a heat-absorbing part 13 directly or indirectly brought into contact with the heating member 2 in a thickness direction of the graphene sheet 10; and a heat-conducting part 14 extending from the heat-absorbing part 13, and having a leading end directly or indirectly brought into contact with the heat dissipation member 3. The heat-conducting part 14 is formed in a substantially sheet-like shape having a predetermined thickness. The heat-absorbing part 13 has a plurality of faces substantially opposed to the heating member 2 in the thickness direction. The heat-absorbing part is folded in a three-dimensional shape having a length equal to or larger than a thickness of the heat-conducting part 14 in the thickness direction.SELECTED DRAWING: Figure 1

Inventors:
Nobuhide Seo
Hirano Takuo
Application Number:
JP2016220167A
Publication Date:
June 13, 2018
Filing Date:
November 11, 2016
Export Citation:
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Assignee:
Mazda Corporation Inc
International Classes:
H05K7/20; H01L23/36; H01L23/373
Domestic Patent References:
JP201618813A
JP2015216184A
JP2017130490A
Attorney, Agent or Firm:
Motoaki Nagata
Eiji Ota
Hiroshi Nishimura
Kitamura Yoshiaki
Yoshiaki Nagata