Title:
HEAT-CONDUCTIVE COMPOSITION
Document Type and Number:
Japanese Patent JP2003113313
Kind Code:
A
Abstract:
To provide a heat-conductive composition which can lower the initial heat resistance of a phase change type heat-conductive sheet.
This heat-conductive composition comprises a wax and further substantially spherical boron nitride as a filler. The average particle diameter and the filling rate of the substantially spherical boron nitride are preferably 20 to 100 μm and 10 to 30 vol.%, respectively.
Inventors:
YAMAZAKI YOSHINAO
OKADA MICHIHIKO
TANZAWA TOMOYA
OKADA MICHIHIKO
TANZAWA TOMOYA
Application Number:
JP2001289591A
Publication Date:
April 18, 2003
Filing Date:
September 21, 2001
Export Citation:
Assignee:
THREE M INNOVATIVE PROPERTIES
International Classes:
C08J5/18; C08K3/38; C08L23/20; C08L91/06; C09K5/06; H01L23/427; (IPC1-7): C08L91/06; C08J5/18; C08K3/38; C08L23/20
Attorney, Agent or Firm:
Takashi Ishida (4 others)