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Title:
HEAT CONDUCTIVE PRESSURE-SENSITIVE ADHESIVE COMPOSITION, HEAT CONDUCTIVE SHEET-LIKE MOLDED PRODUCT AND METHOD FOR PRODUCING THE SAME
Document Type and Number:
Japanese Patent JP2005105028
Kind Code:
A
Abstract:

To obtain a heat conductive pressure-sensitive adhesive composition having sufficient pressure-sensitive adhesion, especially excellent balance among hardness, pressure-sensitive adhesion and shape retention properties and sufficient heat conductivity, and to prepare a heat conductive pressure-sensitive adhesive sheet.

The heat conductive pressure-sensitive adhesive composition comprises an acrylic or a methacrylic ester copolymer prepared by polymerizing a monomer mixture composed of specific amounts of an acrylic or a methacrylic ester monomer, a monomer having an organic acid group and a monomer copolymerizable therewith, respectively, in the presence of a specified (meth)acrylic ester copolymer and in the presence of a thermal polymerization initiator and an internal crosslinking agent having ≥2 polymerizable unsaturated bonds and a heat conductive inorganic compound.


Inventors:
OGIWARA MANABU
MIKUNI TAKAMITSU
IWABUCHI SATOSHI
Application Number:
JP2003336998A
Publication Date:
April 21, 2005
Filing Date:
September 29, 2003
Export Citation:
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Assignee:
NIPPON ZEON CO
International Classes:
B32B27/30; C09J7/02; C09J133/04; C09J151/00; H01L23/36; B32B7/12; (IPC1-7): C09J151/00; B32B7/12; B32B27/30; C09J7/02; C09J133/04; H01L23/36
Domestic Patent References:
JP2002285121A2002-10-03
JPH11269438A1999-10-05
JPH11181368A1999-07-06
JP2001279196A2001-10-10
JP2003105299A2003-04-09
JP2002322447A2002-11-08
JPH10316953A1998-12-02
JPH0688061A1994-03-29
JP2002294192A2002-10-09
JP2000281997A2000-10-10
JP2002322449A2002-11-08



 
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