Title:
HEAT CONDUCTIVE PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND HEAT CONDUCTIVE PRESSURE-SENSITIVE ADHESIVE SHEET
Document Type and Number:
Japanese Patent JP2016188287
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a heat conductive pressure-sensitive adhesive sheet which is excellent in thermal conductivity, flame retardancy and flexibility and causes no occurrence of bleed-out which causes a problem for practical use and to provide a heat conductive pressure-sensitive adhesive composition suitably used for producing the sheet.SOLUTION: There are provided: a heat-conductive pressure-sensitive adhesive composition (D) which comprises an acrylic resin (A), a heat conductive filler (B) and a triaryl phosphate (C); and a heat conductive pressure-sensitive adhesive sheet (E) which is obtained by molding the composition (D) into a sheet shape.SELECTED DRAWING: None
Inventors:
ITO TOYOKAZU
NISHIOKA RYOKO
TANAKA HIDEKAZU
NISHIOKA RYOKO
TANAKA HIDEKAZU
Application Number:
JP2015068523A
Publication Date:
November 04, 2016
Filing Date:
March 30, 2015
Export Citation:
Assignee:
NIPPON ZEON CO
International Classes:
C09J133/00; C08F2/44; C08F265/06; C09J7/00; C09J11/04; C09J151/00
Attorney, Agent or Firm:
Kishimoto Tatsuto
Akihiko Yamashita
Noriyuki Yamamoto
Akihiko Yamashita
Noriyuki Yamamoto