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Title:
HEAT CONDUCTIVE, PRESSURE SENSITIVE FOAM SHEET AND METHOD FOR PRODUCING THE SAME
Document Type and Number:
Japanese Patent JP2007217478
Kind Code:
A
Abstract:

To provide a heat conductive, pressure sensitive foam sheet not only excellent in balance between hardness and pressure sensitive adhesiveness but excellent in initial adhesiveness to exothermic bodies and having no time-dependent reduction of adhesiveness to the exothermic bodies and a method for producing the same.

The heat conductive, pressure sensitive foam sheet has dome-like protrusions on the surface. The method for producing the heat conductive, pressure sensitive foam sheet is to hold a foaming composition comprising a (meth)acrylic acid ester polymer copolymer, a (meth)acrylic acid ester monomer mixture, a heat polymerization initiator, a heat polymerization initiator, a heat conductive compound and a heat degrading foaming agent in a sheet-like state with a polyester film, and in the state, heat the composition in a temperature ranging from 10°C lower than the heat decomposition temperature of the heat degrading foaming agent to 10°C higher than the heat decomposition temperature of the heat degrading foaming agent.

COPYRIGHT: (C)2007,JPO&INPIT


Inventors:
SAKATANI MITSUO
EGAWA RIYOUKO
KUMAMOTO TAKURO
Application Number:
JP2006037340A
Publication Date:
August 30, 2007
Filing Date:
February 15, 2006
Export Citation:
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Assignee:
NIPPON ZEON CO
International Classes:
C09J7/00; C09J7/02; C09J11/00; C09J133/06; C09J151/00; C09J201/00
Domestic Patent References:
JP2005105028A2005-04-21
JP2005239744A2005-09-08
JP2000169803A2000-06-20
JPH0867861A1996-03-12
JPS58125776A1983-07-26
Foreign References:
WO2004104129A12004-12-02
WO2005059053A12005-06-30
Attorney, Agent or Firm:
Iwao Yamaguchi
Yoshihide Komada
Kiyoshi Matsuzaki