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Title:
HEAT-CONDUCTIVE SHEET AND HEAT-CONDUCTIVE SHEET PACKAGE
Document Type and Number:
Japanese Patent JP2007283509
Kind Code:
A
Abstract:

To provide a heat-conductive sheet excellent in handling properties and fitting properties and heat-conductive package fitted with the heat-conductive sheet.

The heat-conductive package 11 has the heat-conductive sheet 21 (sheet 21) and a package 31 which is formed in the shape of a bag and packs the sheet 21. The sheet 21 has a sheet body 22 which intervenes between a heating element and a radiator to be used and an adhesive layer 23 formed on the outer surface 22a of the sheet body 22. The coefficient of static friction of the sheet body 22 is 1.0 or below. The adhesive layer 23 has adhesive properties higher than those of the sheet body 22 and is formed in part of the outer surface 22a of the sheet body 22. The package 31 has an opening 32 and a notch 33 extending from the opening 32. The adhesive layer 23 is exposed from the notch 33.

COPYRIGHT: (C)2008,JPO&INPIT


Inventors:
OTA MITSURU
Application Number:
JP2006110066A
Publication Date:
November 01, 2007
Filing Date:
April 12, 2006
Export Citation:
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Assignee:
POLYMATECH CO LTD
International Classes:
B32B7/10; B65D77/00; B65D77/30; H01L23/373; H05K7/20
Domestic Patent References:
JP2005060594A2005-03-10
JP2005146057A2005-06-09
JP2003198166A2003-07-11
JP2001110965A2001-04-20
JP2001294676A2001-10-23
Attorney, Agent or Firm:
Hironobu Onda
Makoto Onda