Title:
Heat cutoff device
Document Type and Number:
Japanese Patent JP6316724
Kind Code:
B2
Abstract:
A thermal cut-off device can include a case 2, a first electrically conductive lead 4 disposed at a first end of the case, a thermally responsive pellet 32 housed within the case, a second electrically conductive lead 16 disposed at a second end of the case and having a distal end 20 including a contact surface (38), an electrically conductive moveable contact 26 disposed between the pellet and the second lead, a first biasing member 28 disposed between the pellet and the contact, and a second biasing member 30 disposed between the contact and the second end of the case. The distal end of the second electrically conductive lead has a concave portion (44), and the contact surface (38) comprises an annular portion that encircles a periphery of the distal end.
More Like This:
| JPS5826425 | TEMPERATURE FUSE |
Inventors:
Chuon Nguyen
George Clark
George Clark
Application Number:
JP2014203149A
Publication Date:
April 25, 2018
Filing Date:
October 01, 2014
Export Citation:
Assignee:
Therm-Oh-Disc Incorporated
International Classes:
H01H37/76
Domestic Patent References:
| JP2009152219A | ||||
| JP2012248490A | ||||
| JP8045404A | ||||
| JP1038742U | ||||
| JP9063441A | ||||
| JP57117529U |
Foreign References:
| WO2013077286A1 | ||||
| US5530417 |
Attorney, Agent or Firm:
Kurata Masatoshi
Yoshihiro Fukuhara
Nobuhisa Nogawa
Takashi Mine
Katsu Sunagawa
Yoshihiro Fukuhara
Nobuhisa Nogawa
Takashi Mine
Katsu Sunagawa