PURPOSE: To enable a heat dissipating member to be enhanced in heat dissipating properties, board holding properties, and capacity of absorbing the dispersion of heat dissipating members in wiring position by a method wherein a recess is provided on the second surface of an elastic body at a position corresponding to a projection provided on the first surface of the elastic body, a groove is provided on the elastic body surrounding the recess, and the elastic body is made to serve as a heat dissipating member.

CONSTITUTION: Four projections 11a are provided on the rear of a heat dissipating rubber 11, a groove 11b is provided surrounding each of the projections 11a, four U-shaped recesses 13 are provided in the front of the heat dissipating rubber 11 at positions corresponding to the projections 11a provided on the rear, a groove 14 is provided surrounding each of the recesses 13, and the heat dissipating rubber is made to serve as a heat dissipating member. By this setup, a contact surface between an inner power supply and the heat dissipating member can be more lessened in area than usual. Therefore, the dispersion of the inner power supply in mounting position can be absorbed, and heat released from the inner power supply can be dissipating to an outer case by heat conduction. Grooves 12a and 12b are provided in the rear of the heat dissipating member at its lateral sides, whereby the heat dissipating member is capable of holding boards 3a and 3b by fitting them into the grooves 12a and 12b.