To provide a heat dissipating structure, for a composite electronic component, by which a heat dissipating effect is not spoiled and whose number of production processes can be reduced.

A shape-memory alloy is worked and formed in a spring shape so as to be used as a heat conducting component 5, and the heat conducting component 5 is attached to a shield case 1 by making use of coupling protrusions 1a, 1b which are formed inside the shield case (upper lid) 1. A board 4 is housed in the shield case 1 in such a way that the sufficient contact state of a power transistor PH with the heat conducting component is obtained, and the board 4 is fixed by protrusions 1c, 1d inside the shield case 1. At this time, the power transistor PH and the heat conducting component 5 and well as the heat conducting component 5 and the shield case 1 are brought into contact with each other by the restoring force, of the heat conducting component 5, generated by heat from the power transistor PH.