Title:
HEAT DISSIPATING STRUCTURE OF ELECTRONIC DEVICE
Document Type and Number:
Japanese Patent JPH07147492
Kind Code:
A
Abstract:
PURPOSE: To prevent a package from rising in temperature by a method wherein a heater is provided so as to accelerate an air cooling duct in chimney effect to enhance air in flow rate and to introduce a flow of cold air to the center of the package.
CONSTITUTION: Units 5 each containing electronic circuit packages 4 are built in an electronic device, wherein a convection guide board 7 is provided between the units 5, an air cool ing duct 9 where heaters 10 are built is provided in the rear of the units 5, heat dissipating fins 3 are provided to the packages, and an air flow path 17 which connects the outside of the package 4 to the center of the package 4 is provided inside the package 4.
Inventors:
HIRASAWA SHIGEKI
NAKAZATO NORIO
ASAKAWA YOSHIFUMI
NAKAZATO NORIO
ASAKAWA YOSHIFUMI
Application Number:
JP29625993A
Publication Date:
June 06, 1995
Filing Date:
November 26, 1993
Export Citation:
Assignee:
HITACHI LTD
International Classes:
H05K7/20; (IPC1-7): H05K7/20
Attorney, Agent or Firm:
Ogawa Katsuo
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