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Patent Searching and Data


Title:
HEAT DISSIPATING STRUCTURE OF HEATING ELEMENT
Document Type and Number:
Japanese Patent JP2003332506
Kind Code:
A
Abstract:

To improve workability in the case of fixing and increase sufficiently a heat dissipation effect from a heat dissipating member.

A heating element 1 can be connected thermally with the heat dissipating member 11, without screw-setting the heating element by connecting directly a part between the heat dissipating member 11 and the heat generating element 1 by solder without using a conventional heat dissipating sheet and press metal fittings. A hole for inserting the press metal fittings is not formed in the heating element 1 or the heat dissipating member 11, so that a connection area of the heating element 1 and the heat dissipating member 11 is increased. As a result, the heat dissipating member 11 can take heat away effectively from the heating element 1 and dissipate the heat to the outside.


Inventors:
MUTO HIROMITSU
Application Number:
JP2002142816A
Publication Date:
November 21, 2003
Filing Date:
May 17, 2002
Export Citation:
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Assignee:
DENSEI LAMBDA KK
International Classes:
H01L23/40; H01L23/36; (IPC1-7): H01L23/40; H01L23/36
Attorney, Agent or Firm:
Ushiki Mamoru