Title:
電子素子の放熱装置
Document Type and Number:
Japanese Patent JP7041746
Kind Code:
B2
Abstract:
A cooling apparatus for an electronic element is provided. The cooling apparatus includes a printed circuit board, a housing main body, an additional cooling part, and a heat transfer part. The printed circuit board includes one surface and another surface. A plurality of electronic elements are provided on the one surface of the printed circuit board. The housing main body includes an inner surface and an outer surface. The another surface of the printed circuit board is attached to the inner surface of the housing main body, and the outer surface of the housing main body has a plurality of first cooling ribs provided to protrude therefrom. The additional cooling part is disposed to be spaced apart from the outer surface of the housing main body, and dissipates heat transferred from the housing main body. The heat transfer part has one end connected to the outer surface of the housing main body and another end connected to the additional cooling part to transfer heat generated from the plurality of electronic elements to the additional cooling part.
Inventors:
Duk Young Kim
Jun Wu Yang
Jin So Yo
Chang Woo Yo
Minsik Park
Hey Young Kim
Jun Wu Yang
Jin So Yo
Chang Woo Yo
Minsik Park
Hey Young Kim
Application Number:
JP2020530668A
Publication Date:
March 24, 2022
Filing Date:
December 10, 2018
Export Citation:
Assignee:
KW Incorporated
International Classes:
H05K7/20; F28D15/02; H01L23/40
Domestic Patent References:
| JP8288682A | ||||
| JP3153018U | ||||
| JP2015227768A | ||||
| JP2013505416A | ||||
| JP6163770A |
Foreign References:
| US20090154102 |
Attorney, Agent or Firm:
Patent Business Corporation Imy International Patent Office