Title:
Heat dissipation device
Document Type and Number:
Japanese Patent JP6291923
Kind Code:
B2
Inventors:
Tadanori Tachikawa
Application Number:
JP2014047895A
Publication Date:
March 14, 2018
Filing Date:
March 11, 2014
Export Citation:
Assignee:
富士通株式会社
International Classes:
H01L23/36; H01L23/467; H05K7/20
Domestic Patent References:
| JP63501326A | ||||
| JP3084184U |
Attorney, Agent or Firm:
Shuhei Katayama