Title:
HEAT DISSIPATION FIN
Document Type and Number:
Japanese Patent JPH0945826
Kind Code:
A
Abstract:
To obtain heat dissipation fins which make a reduction in the size of a substrate possible and decrease the number of wiring layers on the substrate possible.
Wirings for transmitting a signal between a plurality of devices 2a and 2b are respectively provided in heat dissipation fins 3 provided in such a way as to extend between the devices 2a and 2b provided on a substrate 1. Thereby, the number of wirings on the substrate can be decreased as many as the number of the wirings, which are provided in the fins, there is no need to make large the substrate and the fins 3, which do not require to increase also the number of wiring layers on the substrate, are obtained.
Inventors:
KURANAGA HIROSHI
Application Number:
JP19171095A
Publication Date:
February 14, 1997
Filing Date:
July 27, 1995
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H01L23/36; H01L23/538; (IPC1-7): H01L23/36; H01L23/538
Attorney, Agent or Firm:
Shigeaki Yoshida (2 outside)