HEAT DISSIPATION MATERIAL COMPOSITION AND HEAT DISSIPATION MATERIAL

Japanese Patent JP2022161859

A

To provide a heat dissipation material composition and a heat dissipation material which can exhibit adhesion in a temperature region of 0°C to 50°C, and has excellent flexibility after having exhibited the adhesion.SOLUTION: A heat dissipation material composition contains a resin (A) that excludes a urethane resin and has a softening point of 0°C to 50°C, an urethane resin (B) and an inorganic filler (C), wherein the ratio (Wa/Wb) of a weight Wa of the resin (A) to a weight Wb of the urethane resin (B) is 0.1 to 100, a ratio (X/Y) of a storage elastic modulus (X) measured at 0°C of a sheet-molded heat dissipation material composition to a storage elastic modulus (Y) measured at 50°C of the sheet-molded heat dissipation material composition is 5-10,000, and the storage elastic modulus (Y) at 50°C is 104 Pa to 106 Pa.SELECTED DRAWING: None

JP5888173	Insulated wire
JP2004122365	CHEMICAL AGENT COMPOSITION AND INK JET RECORDING MEDIUM USING THE COMPOSITION
JPS59500057	[Title of the Invention] It is application to an insulation to a polycaprolactone system heat contraction tape, its adjustment method, a conditioning of Electric conductor, etc.

YOSHIDA KENSUKE
MORI KOICHI
MAMPO YASUAKI

JP2022061735A

October 21, 2022

April 01, 2022

Click for automatic bibliography generation  

SANYO CHEMICAL IND LTD

C08L75/04; C08K3/013; C08L23/08; C08L31/04; C08L33/10; C08L101/12

Previous Patent: INVERTER DEVICE AND MOTOR DEVICE INCLUDING THE SAME

Next Patent: Method for producing (meth)acrylate (co)polymer