Title:
放熱部材、及び放熱部材の製造方法
Document Type and Number:
Japanese Patent JP6502950
Kind Code:
B2
Abstract:
Provided are a heat radiating member allowing a semiconductor element to be bonded with high bondability to a surface of a composite portion composed of a composite material, and a method for producing the same. A heat radiating member includes: a composite portion composed of a composite material which contains particles of a satisfactorily thermally conductive material in a metal matrix; and a metal layer formed on at least one surface of the composite portion and composed of a metal. A method for producing a heat radiating member includes: a preparation step to prepare a composite material which contains particles of a satisfactorily thermally conductive material in a metal matrix; a powder arrangement step to dispose a metal powder composed of metal particles on at least one surface of the composite material; and a heating step to heat the composite material and the metal powder, with the metal powder disposed on the composite material, to form a metal layer composed of a metal of the metal powder on a composite portion composed of the composite material.
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Inventors:
Tatsuya Morikawa
Takanori Kakukura
Iwayama Isao
Takanori Kakukura
Iwayama Isao
Application Number:
JP2016546660A
Publication Date:
April 17, 2019
Filing Date:
September 01, 2015
Export Citation:
Assignee:
Allied Material Co., Ltd.
Sumitomo Electric Industries, Ltd.
Sumitomo Electric Industries, Ltd.
International Classes:
H01L23/373; B22F7/00; C22C1/05; C22C26/00
Domestic Patent References:
| JP2014001439A | ||||
| JP10150124A | ||||
| JP2170452A |
Foreign References:
| CN102130077A |
Attorney, Agent or Firm:
Hiroshi Yamano