Title:
半導体素子用放熱部品
Document Type and Number:
Japanese Patent JP7010592
Kind Code:
B2
Abstract:
A heat dissipation component for a semiconductor element includes: a composite part containing 50-80 vol % diamond powder with the remainder having metal including aluminum, the diamond powder having a particle diameter volume distribution first peak at 5-25 μm and a second peak at 55-195 μm. A ratio between a volume distribution area at particle diameters of 1-35 μm and a volume distribution area at particle diameters of 45-205 μm is 1:9 to 4:6; surface layers on both composite part principal surfaces, each of the surface layers containing 80 vol % or more metal including aluminum and having a film thickness of 0.03-0.2 mm; and a crystalline Ni layer and an Au layer on at least one of the surface layers, the crystalline Ni layer having a film thickness of 0.5-6.5 μm, and the Au layer having a film thickness of 0.05 μm or larger.
Inventors:
Yosuke Ishihara
Takeshi Miyakawa
Kazunori Koyanagi
Takeshi Miyakawa
Kazunori Koyanagi
Application Number:
JP2016546655A
Publication Date:
February 10, 2022
Filing Date:
September 01, 2015
Export Citation:
Assignee:
Denka Co., Ltd.
International Classes:
H01L23/373; B22D18/02; B22D19/00; C22C21/00; C22C26/00; C22F1/04; C25D5/12; C25D5/30; C25D7/00; H05K7/20
Foreign References:
| WO2013015158A1 |
Attorney, Agent or Firm:
Sonoda/Kobayashi Patent Business Corporation