高出力素子用放熱板材 - The Good System Corporation

Title:

高出力素子用放熱板材

Document Type and Number:

Japanese Patent JP6462899

Kind Code:

B2

Abstract:

A heat-dissipating plate comprises a core layer; and two cover layers formed by being laminated on the top and bottom face of the core layer, wherein, the core layer is composed of a composite material in which a carbon phase is composited in a Cu matrix, the cover layer is composed of a Mo—Cu alloy, and the thermal conductivity in the thickness direction of the heat-dissipating plate is at least 300 W/mK, and the thermal expansion coefficient of the heat-dissipating plate in a direction perpendicular to the thickness direction is at most 9×10-6/K.

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Inventors:

Kim, Il-ho
Cho, Myung-fan
Kim, Yong-Suk

Application Number:

JP2017555654A

Publication Date:

January 30, 2019

Filing Date:

September 06, 2016

Export Citation:

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Assignee:

The Good System Corporation

International Classes:

H01L23/373; B32B15/01; C22C26/00; C22C27/04; H05K7/20

Domestic Patent References:

JP2014515876A
JP2008184655A
JP201077013A
JP61183180A
JP2002353356A

Attorney, Agent or Firm:

Harakenzo world patent & trademark

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