Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
HEAT DISSIPATION STRUCTURE FOR ELECTRONIC APPARATUS CASE BODY
Document Type and Number:
Japanese Patent JP2010141022
Kind Code:
A
Abstract:

To provide a heat dissipation structure for an electronic apparatus case body which suppresses the amount of solar radiation reaching the electronic apparatus case body by improving heat dissipation performance in the neighborhood of the top surface of the electronic apparatus case body.

A sunshade member 2 which is formed by combining a plurality of longitudinal plates 2a arrayed in a longitudinal direction with a plurality of horizontal plates 2b arrayed in a horizontal direction to be mutually in a lattice shape is arranged in the neighborhood of the top surface of the electronic apparatus case body 1. Thus, the heat dissipation performance is improved in the neighborhood of the top surface of the electronic apparatus case body, and also the amount of solar radiation reaching the electronic apparatus case body is suppressed.

COPYRIGHT: (C)2010,JPO&INPIT


Inventors:
HIMURA NAOTO
UCHINO HIDEKI
Application Number:
JP2008314533A
Publication Date:
June 24, 2010
Filing Date:
December 10, 2008
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H05K7/20
Attorney, Agent or Firm:
Hideaki Tazawa
Hamada Hatsune