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Patent Searching and Data


Title:
HEAT DISSIPATION STRUCTURE OF OUTDOOR INSTALLED APPARATUS
Document Type and Number:
Japanese Patent JP2007173578
Kind Code:
A
Abstract:

To efficiently eject outside a heat generated by electrical parts packaged in a substrate without any excessive enlargement and enormous weighting of an outdoor installed apparatus and further any consumption of a useless electric power.

The heat generated from the electrical parts packaged in the substrate is efficiently ejected in an atmosphere by such a configuration as to seal a substrate projecting outside from a main body 3 with an exterior package body 2 having a thermal conductivity and a weatherproof, and as to mount the substrate itself in the state of projecting the substrate itself outside from the main body 3. Consequently, forced cooling means such as a heat exchanger, a fan or the like is made unnecessary, and the apparatus can eliminate the enlargement and enormous weighting of an outdoor communication apparatus (outdoor installed apparatus)1, and further a consumption of a useless electric power required for driving the fan.


Inventors:
KUBOTA YASUHIRO
Application Number:
JP2005370020A
Publication Date:
July 05, 2007
Filing Date:
December 22, 2005
Export Citation:
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Assignee:
NEC SAITAMA LTD
International Classes:
H05K7/20; H01L23/36
Attorney, Agent or Firm:
Isamu Takahashi