Title:
HEAT DISSIPATION STRUCTURE, AND SOLAR CELL MODULE WITH HEAT DISSIPATION STRUCTURE
Document Type and Number:
Japanese Patent JP2015179798
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a heat dissipation structure which is capable of reducing transportation costs and installation costs, is made lightweight but is strong and inexpensive, improves workability but has high heat dissipation efficiency, and improves a cooling performance.SOLUTION: A heat dissipation structure 1 is formed from a laminate including at least resin-containing radiation layers 3 on both faces of a metal foil 2. The heat dissipation structure 1 may also be characterized in that, by folding one laminate, a heat dissipation fin 8 is provided that is a portion including at least a heat source contact surface 7 in contact with a heat source 11 and a portion where the radiation layers 3 are exposed on both the faces of the laminate.
Inventors:
HAYASHI SHINJI
URYU TOSHIFUMI
UENO SHIGEHIRO
TANAKA MASAYOSHI
URYU TOSHIFUMI
UENO SHIGEHIRO
TANAKA MASAYOSHI
Application Number:
JP2014087185A
Publication Date:
October 08, 2015
Filing Date:
April 21, 2014
Export Citation:
Assignee:
DAINIPPON PRINTING CO LTD
International Classes:
H01L23/36; H02S40/42; H05K7/20
Attorney, Agent or Firm:
Masayuki Masabayashi
Tetsuo Shiba
Hayashi Ichiyoshi
Hisao Kamada
Tetsuo Shiba
Hayashi Ichiyoshi
Hisao Kamada