Title:
HEAT DISSIPATION STRUCTURE
Document Type and Number:
Japanese Patent JP2015019085
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a heat dissipation structure that facilitates design of an electronic apparatus and mounting work to the electronic apparatus, allows heat of a heat generating body to be efficiently transferred to the outside, and prevents the outside from locally having high temperature.SOLUTION: A heat dissipation structure includes a heat generating body, a board for fixing the heat generating body, a heat diffusion film, a support body supporting the heat diffusion film so as to face the heat generating body, and a thermal conductivity material layer in contact with the heat generating body and the heat diffusion film. The heat diffusion film includes a graphite film having heat conductivity in a surface direction of 200 W/mK or more and heat conductivity in a thickness direction of 60 W/mK or less and having a thickness of 350 μm or less, a protective film, and an adhesive layer for both. The thermal conductivity material layer has heat conductivity of 0.9 W/mK or more, and is a material obtained by applying a thermal conductivity curable composition and then curing it.
Inventors:
MATSUMOTO KAZUAKI
INADA TAKU
INADA TAKU
Application Number:
JP2014166573A
Publication Date:
January 29, 2015
Filing Date:
August 19, 2014
Export Citation:
Assignee:
KANEKA CORP
International Classes:
H05K7/20; G06F1/20; H01L23/36; H01L23/373
Domestic Patent References:
| JP2010171030A | 2010-08-05 | |||
| JP2006210940A | 2006-08-10 | |||
| JP2003188323A | 2003-07-04 | |||
| JP2008277432A | 2008-11-13 | |||
| JP2006306068A | 2006-11-09 | |||
| JP2003234585A | 2003-08-22 | |||
| JP2003198166A | 2003-07-11 |
Attorney, Agent or Firm:
Patent business corporation Yasutomi international patent firm