To provide a heat dissipation structure which simplifies design and mounting work of an electronic apparatus, and efficiently discharges heat of a heating element to the outside.
This heat dissipation structure includes: a plurality of heating elements 11a and 11b; a board 12 for fixing the plurality of heating elements thereto; a heat dissipator 13 located at a position facing the heating elements; and a thermally-conductive material layer 14 in contact with the heating elements, the board and the heat dissipator. The thermally-conductive material layer 14 covers surfaces of the plurality of heating elements 11a and 11b. The thermally-conductive material layer 14 is formed of a material of a thermal conductivity ≥0.9 W/mK obtained by applying a thermally-conductive curable composition containing at least a curable vinyl-based polymer (I) and a thermally-conductive filling material (II) to contact all of the plurality of heating elements 11a and 11b, the board 12 and the heat dissipator 13 and thereafter curing the composition.
COPYRIGHT: (C)2011,JPO&INPIT
Matsumoto Kazuaki
Hagiwara Kazuo
