Title:
HEAT-EXPANDABLE MICRO CAPSULE, COMPOSITION FOR FOAM MOLDING
Document Type and Number:
Japanese Patent JP2023134426
Kind Code:
A
Abstract:
To provide a heat-expandable micro capsule capable of producing a molded article having excellent heat resistance and physical properties (abrasion resistance) and a high expansion ratio, a light weight and high hardness, and a composition for foam molding made of the heat-expandable micro capsule.SOLUTION: A heat-expandable micro capsule has a volatile expansion agent as a core agent enclosed in a shell made of a polymer. The shell contains a polymer obtained by polymerization of a monomer composition containing a carbonyl group-containing monomer and silicon dioxide. The heat-expandable micro capsule has a ratio of peak intensity based on a C=O bond in the shell to peak intensity based on silicon dioxide (peak intensity based on a C=O bond/peak intensity based on silicon dioxide) of 0.25-1.0 in IR spectrum analysis and a maximum expansion temperature (Tmax) of 180-225°C.SELECTED DRAWING: None
Inventors:
KAWAGUCHI YASUHIRO
KAWAKAMI TAKESHI
SATO SHUN
KAWAKAMI TAKESHI
SATO SHUN
Application Number:
JP2023096848A
Publication Date:
September 27, 2023
Filing Date:
June 13, 2023
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD
TOKUYAMA SEKISUI IND CORP
TOKUYAMA SEKISUI IND CORP
International Classes:
C09K3/00; B01J13/18; C08F2/44; C08F292/00; C08J9/32
Attorney, Agent or Firm:
Patent Attorney Firm WisePlus