Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
HEAT FORMABLE PRESSURE SENSITIVE ADHESIVE AND PRESSURE SENSITIVE ADHESIVE
Document Type and Number:
Japanese Patent JP2002309222
Kind Code:
A
Abstract:

To solve problems in a pressure sensitive adhesive that it is impossible to closely plaster the conventional pressure sensitive adhesive on a substrate since a re-plastering property is preferential and then the pressure sensitive adhesive member has Usually poor tackiness (initial adhesive force) and poor adhesive force, that easiness and workability of plastering are decreased since bubbles are easily included during plastering and that it is impossible to obtain both properties since the easiness of plastering is decreased as long as the re-plastering property is preferential.

A heat foamable pressure sensitive adhesive is obtained by compounding a foaming agent with a pressure sensitive adhesive having a peeling force to the substrate of not more than 3.0 N/25 mm at an ambient temperature, a shearing adhesive force of not less than 98 N/cm2 and a dynamic modulus of 1 to 1,000 N/cm2 heated at 150 to 200°C wherein the adhesive force is decreased or varnished due to swelling or foaming of the foaming agent during heating. A pressure sensitive adhesive tape is obtained by use of the heat foamable adhesive agent.


Inventors:
HATAKEYAMA YUJI
YAMASHITA MASAMI
OSHIMA HIROAKI
Application Number:
JP2001116882A
Publication Date:
October 23, 2002
Filing Date:
April 16, 2001
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
TOYO CHEMICALS CO LTD
International Classes:
C09J7/02; C09J9/00; C09J11/00; C09J201/00; H01L21/301; (IPC1-7): C09J201/00; C09J7/02; C09J9/00; C09J11/00; H01L21/301