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Patent Searching and Data


Title:
HEAT-INSULATING MOLDING OF RIGID POLYURETHANE FOAM AND METHOD FOR PRODUCING THE SAME
Document Type and Number:
Japanese Patent JP2004331772
Kind Code:
A
Abstract:

To obtain a heat insulating molding for reducing the coefficient of thermal conductivity of a heat insulating molding composed of rigid polyurethane foam using a blowing agent substitute and to provide a method for molding the same.

The molding has a minor axis direction as an effective heat insulation direction, the average value of the ratio A/B of the major axis A to the minor axis B of 1.8-2.5 and ≥50% closed cell ratio when cell structure in the rigid polyurethane foam is closely related to an ellipse. The method for producing the heat-insulating molding of the rigid polyurethane foam having closed cells comprises injecting a composition for urethane foam into a void, after foaming, starting compression at a time Ts represented by formula of gel time≤Ts≤125×log10 (gel time) and compressing the void in the effective heat insulation direction until the volume of the void reaches 40-95% of the volume of the composition in foaming when the composition has 100% volume in foaming.


Inventors:
HAYASHI OSAMI
SATO KENICHI
Application Number:
JP2003128178A
Publication Date:
November 25, 2004
Filing Date:
May 06, 2003
Export Citation:
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Assignee:
MITSUI TAKEDA CHEMICALS INC
International Classes:
C08G18/00; C08G101/00; (IPC1-7): C08G18/00
Attorney, Agent or Firm:
Eisuke Fujimoto
Masayoshi Kanda
Akio Miyao