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Title:
HEAT INSULATING PANEL
Document Type and Number:
Japanese Patent JP2009101561
Kind Code:
A
Abstract:

To provide a heat insulating panel which presses a film member surely with the packing of a foamed heat insulator and blocks an injection hole formed in a frame member.

In the heat insulating panel P comprising a pair of surface plates 10, the frame member 20 set between the side parts of both surface plates 10, and the foamed heat insulator 40 which is injected/packed by a nozzle inserted into a space 30 formed by both surface plates 10 and the frame member 20 through the injection hole 25 formed in the frame member 20, the flexible thin film member 50 is installed on the space 30 side of the frame member 20 to block the injection hole 25, the lower part 52 of the film member 50 is adhered to the frame member 20, and a folded strip 53 folded downward is installed at the upper end of the film member 20. When the film member 50 is displaced to the space 30 side by the nozzle, and the foamed heat insulator 40 is injected into the space 30, foamed, and packed, the foamed heat insulator 40 presses the folded strip 53, and the injection hole 25 is blocked by the film member 50.


Inventors:
MATSUI HIKOKAZU
Application Number:
JP2007274641A
Publication Date:
May 14, 2009
Filing Date:
October 23, 2007
Export Citation:
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Assignee:
NIKKEI PANEL SYSTEM KK
International Classes:
B29C39/10; B29K105/04; B29L9/00
Domestic Patent References:
JP2006001263A2006-01-05
JP2006095801A2006-04-13
JPS56134590U1981-10-13
JPH05220762A1993-08-31
JP2006275434A2006-10-12
Attorney, Agent or Firm:
Kikuhiko Nakamoto