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Patent Searching and Data


Title:
HEAT-INSULATING PANEL
Document Type and Number:
Japanese Patent JPH11210107
Kind Code:
A
Abstract:

To provide a heat-insulating panel contributable to the enhancement of yield strength, earthquake resistance, durability, fire protection, and fire resistance while forming a heat-insulating layer in a building, easy to manufacture and excellent in the execution of works and workability, and considering the health of the users and residents.

A heat-insulating panel is made up of a base plate 5 in which an intermediate layer 6 making a principal component of an inorganic foaming agent and added with a binder is laminatedly formed and integrated between an upper layer 7 and a lower layer 8 making a principal component of mineral fibers and inorganic power and formed by adding a binder and a heat-insulating member 1 arranged on one side of the base plate 5. The heat-insulating member 1 is that in which the core material 2 consisting of a heat-insulating material is sandwiched between a sheet-shaped surface material 3 and a rear face material 4.


Inventors:
UMETSU HIROYUKI
TAKIGUCHI HIDEKI
Application Number:
JP1570698A
Publication Date:
August 03, 1999
Filing Date:
January 28, 1998
Export Citation:
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Assignee:
IG TECH RES INC
International Classes:
E04B1/80; B32B5/22; B32B9/00; B32B9/02; B32B18/00; B32B19/06; E04B1/94; (IPC1-7): E04B1/80; B32B5/22; B32B9/00; B32B9/02; B32B18/00; B32B19/06; E04B1/94