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Title:
HEAT INSULATING WATERPROOF STRUCTURE, AND WATERPROOF SHEET FIXING DEVICE FOR USE THEREIN
Document Type and Number:
Japanese Patent JP2008025184
Kind Code:
A
Abstract:

To provide a heat insulating waterproof structure which is formed with a heat insulating material layer laid on a substrate, a waterproof sheet stretched on an upper surface of the heat insulating material layer, and fixing devices for fixing the waterproof sheet onto the substrate, wherein the heat insulating waterproof structure effectively prevents a dew condensation phenomenon caused by cold bridge, at a low cost, when the temperature outside a room is extremely different from the temperature inside the room.

The heat insulating waterproof structure is formed with the heat insulating material layer laid on the substrate, the waterproof sheet stretched on the upper surface of the heat insulating material layer, and the fixing devices for fixing the waterproof sheet onto the substrate. The fixing devices are dotted in a gap between the waterproof sheet and the heat insulating material layer, and each consist of a retaining portion having an upper surface thereof fixed to a rear surface of the waterproof sheet, and a fixture for fixing the retaining portion to the substrate. The retaining portion is made of a resin, and has a thermal conduction shielding portion formed between the waterproof layer and the top of the fixture, for preventing dew condensation at the fixture or in the vicinity of the same.


Inventors:
TAJIMA KUNIO
KOJIMA TORU
KINOSHITA TAKEFUMI
DOI TOMOO
Application Number:
JP2006198395A
Publication Date:
February 07, 2008
Filing Date:
July 20, 2006
Export Citation:
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Assignee:
TAJIMA ROOFING CO
JAPAN POWER FASTENING CO LTD
International Classes:
E04D5/14; E04B1/76; E04D11/00
Domestic Patent References:
JPH06136892A1994-05-17
JPH09151574A1997-06-10
Attorney, Agent or Firm:
Koichi Ouchi