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Title:
HEAT-INSULATING WATERPROOF STRUCTURE AND HEAT-INSULATING WATERPROOFING METHOD
Document Type and Number:
Japanese Patent JP2008174910
Kind Code:
A
Abstract:

To provide a heat-insulating waterproof structure and a heat-insulating waterproofing method for a structure using a resin foam excellent in heat resistance.

This heat-insulating waterproof structure 1 comprises: a heat insulating material 3 which is superposed on the bed 2 of the structure; a fixing fitting 4 in which a heat-sealing material is provided on a surface exposed on the front side of the heat insulating material 3 and which is anchored to the bed 2 so as to fix the heat insulating material 3 to the bed 2; and a rubber sheet 5 which is superposed on the heat insulating material 3 and bonded to the fixing fitting 4 by means of the heat-sealing material. The heat insulating material 3 is constituted by foaming a resin composition which contains a copolymer (A) consisting of an aromatic vinyl unit, an unsaturated dicarboxylic anhydride unit and an N-alkyl-substituted maleimide unit, and a copolymer (B) consisting of an aromatic vinyl unit and a vinyl cyanide unit.


Inventors:
SATO TAKEISHI
KOBAYASHI HIROSHI
YAMADA NAOAKI
MAKINO YOSHIHARU
Application Number:
JP2007007080A
Publication Date:
July 31, 2008
Filing Date:
January 16, 2007
Export Citation:
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Assignee:
KANEKA CORP
MITSUBOSHI BELTING LTD
International Classes:
E04D11/00; B32B25/08; C08J9/04; E04D5/10; E04D5/14
Domestic Patent References:
JP2005180141A2005-07-07
JPH0425532A1992-01-29
Attorney, Agent or Firm:
Nobuo Nishiki
Tomohiro Matsuda



 
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