Title:
HEAT INSULATION MATERIAL FOR CONSTRUCTION FORMED OF POLYSTYRENE RESIN EXTRUSION FOAMED BODY
Document Type and Number:
Japanese Patent JP3916460
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a low-density and low-cost heat insulation body for construction formed of a polystyrene extrusion foamed body having excellent heat insulation characteristics, dimension stability, and molding performance without using any foaming gas such as CFC gas affecting the environment.
SOLUTION: In this heat insulation material for construction, the polystyrene resin extrusion foamed body containing no halogenated hydrocarbon is formed by laminating and integrating two or more kinds of foamed layers having different mean bubble diameters together, and an occupation ratio of the foamed layer having the mean bubble diameter of 0.25 mm or less is 10 volume % or more. Desirably, the foamed layers containing no radiation reducing agent are arranged at least upper and lower faces of a layer containing the radiation reducing agent.
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Inventors:
Takao Renta
Wakabayashi Masayuki
Wakabayashi Masayuki
Application Number:
JP2001400526A
Publication Date:
May 16, 2007
Filing Date:
December 28, 2001
Export Citation:
Assignee:
Dow Kako Co., Ltd.
International Classes:
E04B1/80; B29C47/00; C08J9/04; E04C2/20; B29K25/00; B29K105/04; B29L31/10; (IPC1-7): E04B1/80; B29C47/00; C08J9/04; E04C2/20; //B29K25:00; B29K105:04; B29L31:10; C08L25:04
Domestic Patent References:
| JP7060816A | ||||
| JP2266925A | ||||
| JP2001088252A | ||||
| JP5049701B2 |
Attorney, Agent or Firm:
Takashi Ishida
Jun Tsuruta
Tetsuji Koga
Masaya Nishiyama
Higuchi Souji
Jun Tsuruta
Tetsuji Koga
Masaya Nishiyama
Higuchi Souji
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