Title:
HEAT INSULATION PLATE AND HEAT INSULATION PLATE FITTING STRUCTURE
Document Type and Number:
Japanese Patent JP2022027227
Kind Code:
A
Abstract:
To provide a heat insulation plate that can improve heat insulation property when being used by being fitted to a member having a corrugated surface, and to provide a heat insulation plate fitting structure.SOLUTION: A heat insulation plate 1 includes a fitting surface 3 of which surface is corrugated by alternately forming a thick wall part 32 and a thin wall part 33 at the surface, and is used such that the fitting surface 3 is fitted to another member. The heat insulation plate 1 includes: a first heat insulation member 5 of which surface constitutes the fitting surface 3; and a second heat insulation member 6 including at least one vacuum heat insulation material 7 and exerting heat insulation property that is higher than the first heat insulation member 5. An end of the heat insulation plate 1 is the thick wall part 32 or the thin wall part 33.SELECTED DRAWING: Figure 1
Inventors:
YAMAGUCHI SHIGEYUKI
HYU ZHIXIN
HASEGAWA TAKASHI
HYU ZHIXIN
HASEGAWA TAKASHI
Application Number:
JP2020131110A
Publication Date:
February 10, 2022
Filing Date:
July 31, 2020
Export Citation:
Assignee:
PANASONIC IP MAN CORP
International Classes:
F16L59/06; E04B1/80; E04C2/26; E04C2/30
Attorney, Agent or Firm:
Patent business corporation Hokuto patent office