Title:
HEAT-INSULATION WATERPROOF STRUCTURE AND HEAT-INSULATING WATERPROOFING METHOD
Document Type and Number:
Japanese Patent JP2008133666
Kind Code:
A
Abstract:
To provide a heat-insulation waterproof structure which is formed of a resin foamed body and excellent in heat insulation properties and solvent resistance, and to provide a heat-insulating waterproofing method.
The heat-insulation waterproof structure 1 is formed by laminating at least a heat insulation material 5 and a vinyl chloride resin sheet 6 on an underlayer surface 2 of a construction. The heat insulation material 5 is obtained by foaming a resin composition containing: a copolymer (A) formed of an aromatic vinyl unit, an unsaturated dicarboxylic acid anhydride unit, and an N-alkyl-substituted maleimide unit; and a copolymer (B) formed of the aromatic vinyl unit and a vinyl cyanide unit.
Inventors:
SATO TAKEISHI
KOBAYASHI HIROSHI
KOBAYASHI HIROSHI
Application Number:
JP2006320739A
Publication Date:
June 12, 2008
Filing Date:
November 28, 2006
Export Citation:
Assignee:
KANEKA CORP
International Classes:
E04D11/00; B32B5/18; B32B27/30; E04D5/06
Domestic Patent References:
JPH0345682A | 1991-02-27 | |||
JPH0425532A | 1992-01-29 | |||
JPH10217396A | 1998-08-18 |
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