Title:
Heat management of an electronic devide based on a consciousness model
Document Type and Number:
Japanese Patent JP6273299
Kind Code:
B2
Abstract:
Some implementations provide a method for performing thermal management of an electronic device. The method determines a sensation value based on (i) a temperature of the electronic device, and (ii) a temperature rate change of the electronic device. The method associates a discomfort level from a plurality of discomfort levels, based on the determined sensation value, to the electronic device. At least one discomfort level is dynamically adjustable. The discomfort level specifies a maximum allowed activity for a processing unit of the electronic device. In some implementations, the discomfort level specifies how thermally uncomfortable the electronic device is for a user of the electronic device. In some implementations, each discomfort level from the several discomfort levels is associated with a particular range of sensation values. The sensation value is based on a user adjustable sensation model. The user adjustable sensation model is based on one of several thermal coefficient constants.
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Inventors:
Hee Jun Park
Application Number:
JP2015560223A
Publication Date:
January 31, 2018
Filing Date:
February 21, 2014
Export Citation:
Assignee:
Qualcomm, Inc.
International Classes:
G06F1/04; G06F1/20
Domestic Patent References:
| JP2005135350A |
Foreign References:
| US20120179303 | ||||
| US20110301778 |
Attorney, Agent or Firm:
Yasuhiko Murayama
Kuroda Shinpei
Kuroda Shinpei
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