Title:
被着物の加熱剥離方法及び被着物加熱剥離装置
Document Type and Number:
Japanese Patent JP4716668
Kind Code:
B2
Abstract:
The present invention intends to provide a method of thermal adherend release by which, when part of adherends (15) on a heat-peelable pressure-sensitive adhesive sheet (12) are desired to be thermally released therefrom, the desired part only can be easily and speedily released. A method of thermal adherend release, wherein part of adherends (15) adherent to a heat-peelable pressure-sensitive adhesive sheet (12) having a heat-expandable layer (13) containing a foaming agent are selectively released from the pressure-sensitive adhesive sheet, wherein the method comprises partly heating the heat-peelable pressure-sensitive adhesive sheet (13) in an atmosphere having a temperature of 50°C or higher at which the heat-expandable layer does not expand to thereby selectively release the adherends (15).
Inventors:
Tomoko Doi
Shoichi Tanimoto
Yukio Arimitsu
Daisuke Shimokawa
Michio Kawanishi
Shoichi Tanimoto
Yukio Arimitsu
Daisuke Shimokawa
Michio Kawanishi
Application Number:
JP2004125331A
Publication Date:
July 06, 2011
Filing Date:
April 21, 2004
Export Citation:
Assignee:
NITTO DENKO CORPORATION
International Classes:
C09J5/00; H01L21/301; C09J5/08; C09J7/22; C09J7/38; C09J11/00; H01L21/00; H01L21/52; H01L21/67; H01L21/68
Domestic Patent References:
| JPH04196148A | ||||
| JP2002322436A | ||||
| JP2004087660A |
Attorney, Agent or Firm:
Yukihisa Goto