Title:
ヒートポンプ装置及び弁キット
Document Type and Number:
Japanese Patent JP7012692
Kind Code:
B2
Abstract:
To close a valve even when leakage of a refrigerant occurs during a power failure in a heat pump device including the valve whose opening is maintained while power is not supplied.SOLUTION: A heat pump device having a refrigerant circuit includes: valves (17, 18) that are provided on the refrigerant circuit and whose openings are maintained while power is not supplied; a valve drive circuit (322) operating the valves (17, 18); a valve control section (324) controlling the valve drive circuit (322); and a power supply circuit (PW) supplying a power source to the valve drive circuit (322). The power supply circuit (PW) includes; a first power supply circuit section (P1) receiving power source supply from outside to generate DC voltage; and a second power supply circuit section (P2) for backup that receives power source supply from outside to store electricity in a capacitor and in which the capacitor is connected in parallel with a first output electrical path (L1) of the first power supply circuit section (P1).SELECTED DRAWING: Figure 3
Inventors:
Yusuke Fujimoto
Ryuichi Toyoda
Kentaro Taoka
Kevin Cornelis
David Stern
Ryuichi Toyoda
Kentaro Taoka
Kevin Cornelis
David Stern
Application Number:
JP2019170547A
Publication Date:
January 28, 2022
Filing Date:
September 19, 2019
Export Citation:
Assignee:
Daikin Industries, Ltd.
International Classes:
F25B49/02; F16K31/06
Domestic Patent References:
| JP2008286464A | ||||
| JP2000219033A | ||||
| JP2005121333A | ||||
| JP2016095130A | ||||
| JP2003130482A | ||||
| JP2010058609A | ||||
| JP2005337687A | ||||
| JP2015141000A | ||||
| JP2015104938A | ||||
| JP9285024A | ||||
| JP2010068620A |
Foreign References:
| WO2018025367A1 | ||||
| WO2018216127A1 | ||||
| WO2018078729A1 |
Attorney, Agent or Firm:
Shinki Global IP Patent Corporation