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Patent Searching and Data


Title:
HEAT PUMP DEVICE
Document Type and Number:
Japanese Patent JP2007218464
Kind Code:
A
Abstract:

To provide a heat pump device capable of properly keeping temperatures of a compressor lubricant and an expander lubricant, and improving recovery power in the expander.

This heat pump device comprises a refrigerant circuit constituted by successively connecting a compressor 31, a radiator 32, the expander 33 and an evaporator 34, and a temperature of the compressor lubricant stored in a shell of the compressor 31 for lubricating a mechanical portion of the compressor 31, and a temperature of the expander lubricant stored in a shell of the expander 33 for lubricating a mechanical portion of the expander 33 are different from each other. As the temperatures of the lubricants lubricating the mechanical portions of the compressor 31 and the expander 33 can be independently properly kept, and a viscosity of the lubricants to achieve preferred performance to sliding loss of the mechanical portions of the compressor 31 and the expander 33, and refrigerant leakage from a clearance, can be kept, efficiencies of the compressor and the expander can be respectively improved, and the performance of the heat pump can be improved.

COPYRIGHT: (C)2007,JPO&INPIT


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Inventors:
NAKATANI KAZUO
OKAZA NORIHO
Application Number:
JP2006037450A
Publication Date:
August 30, 2007
Filing Date:
February 15, 2006
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
F25B1/00
Attorney, Agent or Firm:
Fumio Iwahashi
Hiroki Naito
Daisuke Nagano