Title:
HEAT PUMP DEVICE
Document Type and Number:
Japanese Patent JP2009250580
Kind Code:
A
Abstract:
To provide a heat pump device capable of improving a COP easily.
An expansion means (7) of the heat pump device (1) comprises a parallel path (11). In the parallel path (11), an expansion device (9) capable of recovering power and an expansion valve (10) for decompressing a refrigerant by expansion are arranged in parallel, the refrigerant is made to flow in the expansion device (9) when switching to a refrigerant flow for using an outdoor heat exchanger (6) as a radiator is performed by a refrigerant flow switching means (5), and the refrigerant is made to flow in the expansion valve (10) when switching to a refrigerant flow for using the outdoor heat exchanger (6) as an evaporator is performed by the refrigerant flow switching means (5).
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Inventors:
NEGISHI MASAMI
Application Number:
JP2008102349A
Publication Date:
October 29, 2009
Filing Date:
April 10, 2008
Export Citation:
Assignee:
SANDEN CORP
International Classes:
F25B13/00; F24F5/00; F24H1/00; F25B11/02
Attorney, Agent or Firm:
Koji Nagato
Junichi Yamanaka
Junichi Yamanaka
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