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Title:
HEAT PUMP DEVICE
Document Type and Number:
Japanese Patent JP2013148294
Kind Code:
A
Abstract:

To provide a heat pump device that reduces the propagation of vibration to an evaporator to achieve a product with reduced noise.

A heat pump device includes: a refrigerant circuit in which a compressor 4, a radiator 5, a pressure reducing means 6, and an evaporator 7 are sequentially connected; a liquid-gas heat exchanger 16 for exchanging heat between a refrigerant from a refrigerant outlet side of the radiator 5 to a refrigerant inlet side of the pressure reducing means 6, and a refrigerant from a refrigerant outlet side of the evaporator 7 to a suction part of the compressor 4; and a muffler 17 disposed in a part of the refrigerant circuit from the liquid-gas heat exchanger 16 to the intake part of the compressor 4. A pipe length L1 from the muffler 17 to the intake part of the compressor 4 is longer than a pipe length L2 from the liquid-gas heat exchanger 16 to the muffler 17.


More Like This:
JPH0921563HOT WATER FEEDER
Inventors:
KOBAYASHI TAKAO
Application Number:
JP2012009886A
Publication Date:
August 01, 2013
Filing Date:
January 20, 2012
Export Citation:
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Assignee:
PANASONIC CORP
International Classes:
F24H1/00; F24F1/12; F24F1/30
Domestic Patent References:
JP2005226987A2005-08-25
JPS62152166U1987-09-26
JP2007271212A2007-10-18
JP2013096674A2013-05-20
JP2012107791A2012-06-07
Attorney, Agent or Firm:
Hiroki Naito
Daisuke Nagano
Kentaro Fujii



 
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